Category:Tape-automated bonding

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tape-automated bonding

industrial process in electronics

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technology
production process

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semiconductor industry

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Q1487512
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Media in category "Tape-automated bonding"

The following 5 files are in this category, out of 5 total.

A silicon IC as tape automated bonded (TAB) on the 35mm tape. Upper picture shows IC front side as glob topped and lower picture backside of the IC.png 982 × 914; 1.5 MB
Example of a TAB tape after assembly. Chips can be located on othe places tha in the middle of the tape, in this case on the left hand side of the tape. Glob topped chips are visible as black, one missing and the rest without glob top.png 592 × 888; 1.06 MB
LCD Panel style (3-types).PNG 1,002 × 2,420; 157 KB
Tape-automated bonding carrier DE.svg 701 × 576; 45 KB
Tape-automated bonding carrier.svg 625 × 625; 56 KB

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