To create the advanced equipment used in chip design and production—fabless companies, foundries, and IDMs depend on Lam. Get a basic understanding of each and learn how we ensure our customers meet the latest design and manufacturing demands. https://bit.ly/3z8KhJ9
Impressive
3D DRAM is a cutting-edge design that requires innovative processes and designs never seen before. To overcome potential roadblocks, we use our SEMulator3D® software to virtually explore various 3D architectures. Check out our findings! https://bit.ly/3VO8T1C
From identifying 40+ energy-efficiency opportunities for our top suppliers in Korea and Japan to saving 2M+ kilowatt-hours (kWh) of energy across our Tualatin, Oregon, facility, as well as our Fremont and Livermore facilities — we remain dedicated to acting with purpose for a better world. Our latest Environmental, Social, and Governance (ESG) report outlines our progress and achievements throughout 2023. https://bit.ly/3XNygDf
We’re attending SEMI’s #SEMICONWest 2024 conference in San Francisco, CA, from July 9 to 11! Join us to explore groundbreaking technologies in the #semiconductor industry and gain insights from our experts, including: ➖Managing Director, Specialty Technologies and Strategic Marketing, Michelle Bourke ➖ Product Line Head, Semiverse™ Solutions Joseph Ervin ➖ Vice President, Patterning Technology Group Richard Wise Learn more. https://bit.ly/3RHA9xx
Happy #InternationalPrideDay from Lam Research! 🏳️🌈 We strive to create an environment where everyone feels valued, included, and empowered to reach their full potential. This past month, employees across our campuses arranged an art installation and held a flag-raising ceremony to showcase our support for the LGBTQ+ community and their contributions to history and society.
We believe it’s essential to integrate Environmental, Social, and Governance (ESG) principles across our business practices. Learn how we position our company for success via our 2023 ESG report. https://bit.ly/4eDjd59
PiezoMEMS devices require thin films of piezoelectric materials to achieve optimal performance. This is where Pulsus™ comes in—our pulsed laser deposition (PLD) system enables the deposition of high-quality scandium aluminum nitride (ScAlN) films for improved performance of piezoMEMS applications. Read more about our breakthrough technology. https://bit.ly/3xsB2Da
High-bandwidth memory (HBM) boasts improved memory bandwidth and efficiency with a lower footprint than traditional memory alternatives. In a recent The_TechArena whitepaper, explore how Lam’s breakthroughs in advanced #semiconductor packaging are key to creating HBM for the AI era. https://bit.ly/3z9K1cU
Lam Fellow and Leap reviewer Samantha Tan is on a mission to solve the unsolvable. With 30+ years in the semiconductor industry, learn why she believes the key to successful pathfinding projects starts with building the right team! #INWED24 https://bit.ly/3z9T65z
“The truth is that this industry found me. Sometimes you learn to love what you are immersed in rather than the other way around.” – Technical Managing Director Keren Kanarik. In her 20+ year career at Lam, Keren launched the field of atomic layer etching (ALE), invented our patent for Mixed Mode Pulsing (MMP), and more. Explore her impressive accomplishments. https://bit.ly/3Rqa0Df
Fresh graduate with a Bachelor of Manufacturing Engineering Technology in Supply Chain Management (Honours)
5dExcellent work